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The Boeing Company is looking for a Microelectronics Test Engineer (Associate, Mid-Level or Senior) based out of Tukwila, WA.

We are Boeing Research & Technology (BR&T): Boeings global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future!   TheFutureIsBuiltHere  ChangeTheWorld

Within BR&T, Boeing’s Solid-State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems.  We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state-of-the-art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification), packaging, and test in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers, and is nationally recognized in aerospace microelectronics design communities. SSED’s large staff of microelectronics engineers conduct research, design, and test microelectronics hardware in support of these projects.

SSED executes a variety of exciting, technically challenging projects, offering endless opportunities to develop depth and breadth of technical skills.  We offer on-the-job learning opportunities and long-term potential for career growth into both technical leadership and management positions and seek curiosity, creativity, innovation, attention to detail, clear communication, and the ability to understand and meet customer needs. 

We are seeking test engineers to execute and plan Integrated Circuit (IC) and microelectronics test activities, to develop test processes, and to grow test capabilities.  SSED tests custom-designed ICs, ranging from characterization test chips to SoCs to integrated chip sets, including bring up and debug, electrical testing, performance characterization, reliability stresses, radiation testing, and characterization across extreme environments.

Position Responsibilities:

• Maintains detailed requirements and specifications for various electronic products

• Develops detailed designs of limited scope. Conducts various methods of testing and analysis to support design

• Gathers data for technical performance measures and performs basic analysis

• Provides basic engineering support throughout the lifecycle of the product

• Conducts trade studies and literature research to support future product designs

• Works under general supervision

• Test software and firmware development

• Test fixturing development

• Hardware bring up and debug

• Electrical testing and performance characterization

• Test plan development and execution

This position is expected to be 100 onsite.  The selected candidate will be required to work onsite at one of the listed location options.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science

• 3+ years of experience with the test of integrated circuits

• 3+ years of experience utilizing high-performance microelectronics test equipment (power supply, oscilloscope, spectrum analyzer, network analyzer, prober, etc.)

• 1+ years of experience in printed circuit board fabrication, test, and validation

Preferred Qualifications (Desired Skills/Experience):

• 5+ years of related work experience or an equivalent combination of education and experience

• Experience with Python and FPGA firmware development

• Experience developing and implementing automated test strategies

• Experience with characterization and test of microelectronics for extreme environments (cryogenic and high temp, radiation, etc.)

• Experience with design-for-test strategies and circuit design

• Understanding of IC development flow and tools from device-level modelling and library development; chip-level requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test.

• Understanding of semiconductor device physics

• Understanding of commercial semiconductor fabrication process technologies, including standard CMOS, SOI, SiGe, and GaN.

• Demonstrated track record as a self-motived, independent, high-performance team member

• Excellent verbal and written communication ability

• Active security clearance

Typical Education/Experience: 

Mid-Level (Level 3)

Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 5 or more years related work experience or an equivalent combination of technical education and experience (e.g. PhD, Master+3 years related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Senior (Level 4)

Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years related work experience, Master+7 years related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard

Relocation:

This position offers relocation based on candidate eligibility. Note: Basic relocation will be offered for eligible internal candidates.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift Work Statement:

This position is for 1st shift.

Union:

This is a union represented position

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.  

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.  

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations.

Summary pay range for Mid-Level: $104,550 – $141,450 

Summary pay range for Senior: $126,650 – $171,350 

Applications for this position will be accepted until October 10th 2024

Equal Opportunity Employer:

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.